We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Video equipment.
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Video equipment Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Video equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 日本レーザー Tokyo//Electronic Components and Semiconductors
  2. ハイソル Tokyo//Electronic Components and Semiconductors
  3. 本多電子 産業機器事業部 Aichi//Industrial Electrical Equipment
  4. 日本電磁測器 Tokyo//Industrial Electrical Equipment
  5. 日立ハイテク Tokyo//Industrial Machinery

Video equipment Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Ultrasonic microscope, ultra-high-speed scan, ultrasonic imaging device. 日本レーザー
  2. Full waveform recording ultrasonic imaging device "UVS-101" 日本電磁測器
  3. Ultrasound imaging device 日立ハイテク
  4. Ultrasound Imaging Device 'VSA M350' SRT 本社
  5. 4 Ultrasound imaging device ハイソル

Video equipment Product List

1~7 item / All 7 items

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Ultrasonic microscope, ultra-high-speed scan, ultrasonic imaging device.

KSI's ultrasonic microscope "V Series" demonstrates its power in the semiconductor field, electronic components, ceramic materials, and more with ultra-fast scanning!

The V Series ultrasonic microscope (ultrasonic imaging device) manufactured by KSI in Germany uses ultrasonic waves up to 400 MHz to perform internal flaw detection/internal observation of inspection objects. The principle of the ultrasonic microscope can be found here: https://www.japanlaser.co.jp/technology/ksi_ultrasonic_principle/ It also features a new design probe and a new type of amplifier that achieve approximately 1.5 times faster scanning and high signal-to-noise imaging compared to conventional models. The application range of this series is broad, used in various fields such as composite wafers in semiconductors, semiconductor chips, semiconductor packages, LEDs, plating, and painting. For example, in the semiconductor field, it is used as a non-destructive testing tool, demonstrating its effectiveness in detecting delamination/cracks that are difficult to detect with X-rays. ~V Series Lineup~ 【V-8/V-400】 Standard model for a wide range of applications. Supports everything from quality assurance to R&D. 【V-700/V-1000】 Wide-range scanning model. Effective for inspecting numerous samples. 【V8-DUO / V8-Multihead】 Multi-probe system for applications requiring high throughput.

  • Other microscopes

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Full waveform recording ultrasonic imaging device "UVS-101"

Ultrasonic testing equipment equipped with a variety of software for scanner control and flaw waveform recording.

The "Ultrasonic Testing" of Japan Electromagnetic Measuring Instruments is a testing method that utilizes the reflection of ultrasonic waves to evaluate the presence and location of defects in the target object. The "Full Waveform Recording Ultrasonic Imaging Device" is equipped with a variety of software for different functions, allowing it to accommodate various inspections. With diverse software, it enables a wide range of measurements, including scanner control, defect waveform recording, measurement image display, and probe sound field measurement. 【Features】 ■ Scanner control software ■ Defect waveform recording software ■ Measurement image display software ■ Probe sound field measurement software ■ Data processing software *For more details, please refer to the PDF materials or feel free to contact us.

  • Defect Inspection Equipment
  • Inspection fixture
  • Ultrasonic Oscillator

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Ultrasound imaging device

Non-destructive defect inspection equipment for MEMS devices. From evaluation of bonding interfaces in prototypes to full inspection of mass-produced items.

The "Ultrasonic Imaging Device" is a non-destructive defect inspection device for MEMS devices. Hitachi High-Tech can accommodate everything from the "FineSAT series" for development, prototyping, and small-scale production to the "Wafer LINE" for fully automated wafer inspection. We offer proposals that match your situation with a wide range of options. 【Features】 ■ A 64-bit processing system with enhanced analysis capabilities Capable of measuring up to 400 million points in standard specifications and up to 2 billion points in optional specifications ■ A high-speed scanner with a maximum scanning speed of 2,000 mm/sec, Significantly reduces measurement time by adopting a new ultrasonic pulser ■ Newly developed high-frequency probes (400 MHz) that accommodate various wafers with a rich lineup of probes for both short and long focal distances *For more details, please refer to the PDF materials or feel free to contact us.

  • Other inspection equipment and devices

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Ultrasound Imaging Device 'VSA M350'

Introducing an ultrasonic imaging device that supports various IC inspections, including JEDEC-TRAY IC inspections.

The "VSA M350" is an ultrasonic imaging device that supports various IC inspections, including JEDEC-TRAY IC inspections, 300mm wafer inspections, MLCC inspections, automotive parts inspections, and NO/GO judgment output. It has a pixel count of 100 million pixels and a scanning speed of 1200 mm/s. The measurement range is 350×350×80 mm. 【Specifications (excerpt)】 ■ Measurement range: 350×350×80 (mm) ■ Measurement pitch: 0.001 (mm) ■ Scanning speed: 1200 (mm/s) ■ Standard probe: 35 (MHz) ■ Pixel count: 100 million pixels *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Ultrasound imaging device

This is a product with a super compact, lightweight body designed to easily perform ultrasound examinations anywhere, without being limited to specific locations.

Features ● Compact tabletop size ● Ideal for analyzing voids, delamination, solder defects, and bonding failures ● Supports high-frequency ultrasound from 5 to 100 MHz (other frequencies available) ● High-resolution scanning with a minimum of 10 μm

  • Other inspection equipment and devices

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Ultrasonic Testing Imaging Device HA-60A

Achieving improved operability and high-precision non-destructive testing.

■ The simultaneous display of three modes (A, B, C scopes) makes defect determination easier. ■ You can select a frequency suitable for the work (high-performance polymer concave ultrasonic transducer). ■ A Scope This represents the received sound pressure at the transducer and the propagation time of the ultrasound in a rectangular coordinate system. It allows you to grasp the reflected sound pressure from abnormal areas and the depth from the testing surface. ■ B Scope - Cross-sectional Image The A Scope waveform is represented as a line through brightness modulation, plotted in a rectangular coordinate system with the position (1D) on the sample under the transducer and the sound wave propagation time. The distribution, presence, and depth of abnormal areas under the transducer's scanning line are displayed, allowing for an intuitive understanding of the cross-sectional view. ■ C Scope - Planar Image The presence or absence of abnormal areas or reflected sound pressure under the transducer is brightness modulated (corresponding to taking a point on the sound wave propagation time axis of the B Scope image), plotted in a rectangular coordinate system with the position (2D) on the sample under the transducer. This method involves setting a gate or sampling point on the sound wave propagation time axis before recording and displaying. It provides a clear understanding of the distribution of planar abnormalities, making it suitable for testing flat materials. By changing the slice level, you can also determine changes in defect depth direction.

  • Flaw detection testing

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Ultrasonic Testing Imaging Device 'HA-60A'

It is suitable for inspecting the internal structure and defects of various materials.

The "HA-60A" is an ultrasonic flaw detection imaging device that allows for easy defect judgment through simultaneous display of three modes (A, B, and C scopes). It can use high-performance polymer concave ultrasonic probes with frequencies suitable for the workpiece, allowing selection based on the material, dimensions, and defects of the test object. 【Features】 ■ A Scope - Understand the reflection sound pressure of abnormal areas and the depth from the detection surface. ■ B Scope (Cross-sectional Image) - Displays the distribution, presence, and depth of abnormal areas under the probe scanning line. ■ C Scope (Planar Image) - Enables judgment of flaws in flat objects such as plates based on the distribution of planar abnormalities. *For more details, please download the PDF or feel free to contact us.

  • Defect Inspection Equipment

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